GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

Accelerate tool development and reduce the consumption of physical resources like silicon wafers, chemicals, and gases.

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

The MEMS & Imaging Sensors Summit demonstrated how collaboration, sustainability, and innovation are driving the sensor ...

High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.

This enables the EUV lithography era of today, which is likely to continue for the foreseeable future. Initially, EUV became ...

A New Class of Memory for the AI Era” was published by researchers at Microsoft. Abstract “AI clusters today are one of the ...

Delamination occurs when there is a mismatch in coefficients of thermal expansion (CTE) between the encapsulate materials, such as the mold compound used to encapsulate the semiconductor chip and the ...

Semiconductor Engineering sat down with Dan Brewer and Srikanth Kommu, co-CEOs at Brewer Science, to talk about current and future changes in materials used in semiconductor manufacturing and adjacent ...

How to prevent complex systems from freezing up.